Technology development trend of electronic components from the product development requirements of electronic machine to decide. Miniaturization, high-speed, high-capacity, intelligent, personalized, integrated personal computers, automotive electronics, medical electronics, consumer electronics and other electronic machinery to the six trends in product development, which determines the electronic components, products must the following five aspects of development, to meet the needs of electronic product development machine.
    1, small size.
    Multi-function electronic products and portable electronics products also asked to maintain the original performance based on the ever-shrinking component size. To multi-layer ceramic capacitors (MLCC), for example, the size of the current mainstream products are from the 0603 model to 0402-type transition, but more by the market of high-end product is 0201. Narrow size range of materials and processes involved in the issue, these issues are currently a hot research passive components, a number of new materials and cutting-edge technology (such as nanotechnology, etc.) has begun to be used in ultra-small devices into process. 
    2, multi-functionality.
    Of new product features as electronics continue to increase, chip components are increasingly diverse functional requirements. Despite the quantitative point of view, the chip electronic component-based rates have been as high as 70% or more, but the development of very uneven, with some components due to technology, structure and materials, and other reasons, a larger slice of the difficulty. As with the inductor structure, bead components, its function is not as an inductor, but rather anti-electromagnetic interference, the current chip-based component of the magnetic beads have become the largest category of use chip inductors class components. These new design and material components are electronic components facing new problems. Currently, in order to achieve microwave ceramic components, over-current protection components, sensitive ceramic components, magnetic components such as chip-type transformers, the world is all countries in the development of a low-temperature sintering characteristics and sensitivity of microwave ceramic dielectric materials, ceramic materials and the corresponding multi-layer of burning technology.
    3, integrated modular.
    Because passive electronic components manufacturing processes vary widely in material and technology, it has been a long time in the form of discrete components used. Although it has been the miniaturization of chip components in a series of efforts being carried out, but highly integrated semiconductor device compared to the relatively slow development of much more. In recent years, due to low-temperature co-fired ceramics (LTCC) technologies such as the breakthrough that makes passive integration technology into a practical and industrialization phase, and become a closely watched technical high ground. Based on LTCC technology, chip components and integrated product output has been doubling every two years pace. It is predicted that by 2010, the Mainland China alone LTCC products market will reach 30 billion U.S. dollars.
    4, high-frequency, broadband.
    Electronic products to high-frequency (microwave band) the trend is very strong, such as wireless mobile communication developed to 2GHz, Bluetooth technology is 2.4GHz, short-range wireless data exchange system up to 5.8GHz. In addition, more and more high-speed digital circuit products, optical communications, the development of transfer rate from 2.5Gbps to 10Gbps. These developments are all made of electronic components higher requirements, such as reducing parasitic inductance, parasitic capacitance, raising the resonant frequency, reducing high-frequency ESR, increased high-frequency Q value, etc..
    5, green.
    In the electronic components of the manufacturing process, tend to use a large number of toxic materials, such as cleaning agents, solvents, solder and certain raw materials. Part of the electronic components, finished product, sometimes also contain toxic substances such as mercury, lead and cadmium. Now, some developed countries have legislation to disable these harmful substances, advocating green electronics. China's electronic components industry is also faced with this issue, there are a large number of technical problems to be solved.